Видеокарта Asus Rog Strix GeForce RTX 3060 Ti V2 8 ГБ GDDR6, 256-битный интерфейс, ядро 4864 Cuda, тактовая частота Boost 1695 МГц, скорость памяти 14 Гбит/с, PCI Express 4.0, OpenGL 4.6 | 90YV0G04-M0

ROG-STRIX-RTX3060TI-8G-V2-GAMING

ROG Strix GeForce RTX™ 3060 Ti V2 8GB GDDR6 with LHR offers a buffed-up design with chart-topping thermal performance.

• NVIDIA Ampere Streaming Multiprocessors: The building blocks for the world’s fastest, most efficient GPUs, the all-new Ampere SM brings 2X the FP32 throughput and improved power efficiency. 
• 2nd Generation RT Cores: Experience 2X the throughput of 1st gen RT Cores, plus concurrent RT and shading for a whole new level of ray tracing performance. 
• 3rd Generation Tensor Cores: Get up to 2X the throughput with structural sparsity and advanced AI algorithms such as DLSS. These cores deliver a massive boost in game performance and all-new AI capabilities.
• This GeForce RTX 3060 Ti graphics card with LHR (lite hash rate) delivers 25 MH/s ETH hash rate (est.).
• Axial-tech fan design has been newly tuned with a reversed central fan direction for less turbulence.
• 2.9-slot design expands cooling surface area compared to last gen for more thermal headroom than ever before.
• Super Alloy Power II includes premium alloy chokes, solid polymer capacitors, and an array of high-current power stages.
• GPU Tweak II provides intuitive performance tweaking, thermal controls, and system monitoring.

AXIAL-TECH UPGRADES

Our Axial-tech fan design has been optimized for a new, larger heatsink that features more fins and surface area than last gen. The blade count has been increased on all three fans, with 13 on the center fan and 11 on the auxiliary fans. The barrier ring on the side fans has been slimmed down to allow for more lateral intake and to provide better airflow through the cooling array. The center fan’s extra blades and full-height ring provide boosted static pressure to blast air directly onto the GPU heat spreader.

2.9-SLOT DESIGN

The heat spreader draws heat up into heatpipes that carry it through a fin stack that fills a large 2.9-slot footprint. Increasing the heatsink size compared to the last generation provides more thermal headroom to account for the new high-performance chipset.